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NAND MCP
MemoCom® NAND MCP (Multi-Chip Package) series features larger storage densities and higher performing DRAM for high-end mobile phone and DSC applications. |
| Part Number |
Density |
Speed |
Vcc |
Package |
Flash
Boot |
Note |
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|
256Mb Flash+ 512Mb DDR2 |
x8/x16 |
F:2.7~3.6 / D2:1.7~1.9 |
104ball BGA 9x9(mm) |
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256Mb Flash+ 512Mb DDR2 |
x8/x16 |
F:2.7~3.6 / D2:1.7~1.9 |
119ball BGA 10x13(mm) |
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|
256Mb Flash+ 1Gb DDR2 |
x8/x16 |
F:2.7~3.6 / D2:1.7~1.9 |
119ball BGA 10x13(mm) |
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512Mb Flash+ 512Mb DDR2 |
x8/x16 |
F:2.7~3.6 / D2:1.7~1.9 |
119ball BGA 10x13(mm) |
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|
512Mb Flash+ 1Gb DDR2 |
x8/x16 |
F:2.7~3.6 / D2:1.7~1.9 |
119ball BGA 10x13(mm) |
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1Gb Flash+ 1Gb DDR2 |
x8/x16 |
F:2.7~3.6 / D2:1.7~1.9 |
119ball BGA 10x13(mm) |
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1Gb Flash + 256Mb MD |
x16 |
F:2.7~3.6 / D2:1.7~1.9 |
107ball BGA 10.5x13(mm) |
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1Gb Flash+ 256Mb MSD |
x16 |
F:2.7~3.6 / D2:1.7~1.9 |
107ball BGA 10.5x13(mm) |
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1Gb Flash+ 512Mb MD |
x16 |
F:2.7~3.6 / D2:1.7~1.9 |
107ball BGA 10.5x13(mm) |
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1Gb Flash+ 512Mb MSD |
x16 |
F:2.7~3.6 / D2:1.7~1.9 |
107ball BGA 10.5x13(mm) |
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|
512Mb Flash + 256Mb MD |
x16 |
F:2.7~3.6 / D2:1.7~1.9 |
107ball BGA 10.5x13(mm) |
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|
512Mb Flash+ 256Mb MSD |
x16 |
F:2.7~3.6 / D2:1.7~1.9 |
107ball BGA 10.5x13(mm) |
|
|
|
512Mb Flash+ 512Mb MD |
x16 |
F:2.7~3.6 / D2:1.7~1.9 |
107ball BGA 10.5x13(mm) |
|
|
|
512Mb Flash+ 512Mb MSD |
x16 |
F:2.7~3.6 / D2:1.7~1.9 |
107ball BGA 10.5x13(mm) |
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| 8F-2, No.120, Sec. 2, Gongdao 5th Rd., Hsinchu City, Taiwan |
2009 © MemoCom Corp. All Rights Reserved |
| Tel : +886-3-5730808 Fax : +886-3-5720518 Sales@memocom.com.tw |
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