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| 首页MCP & P-SRAM > NAND MCP |
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NAND MCP
科统科技因应高阶手机及数码相机(DSC)系统上的需求, 成功开发一系列NAND MCP,满足高阶手持式产品之低耗电、与高兼容性的需求，为市面上成本效益最高之解决方案。 |
| 产品名称 |
Density |
Speed |
Vcc |
Package |
Flash
Boot |
Note |
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256Mb Flash+ 512Mb DDR2 |
x8/x16 |
F:2.7~3.6 / D2:1.7~1.9 |
104ball BGA 9x9(mm) |
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256Mb Flash+ 512Mb DDR2 |
x8/x16 |
F:2.7~3.6 / D2:1.7~1.9 |
119ball BGA 10x13(mm) |
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256Mb Flash+ 1Gb DDR2 |
x8/x16 |
F:2.7~3.6 / D2:1.7~1.9 |
119ball BGA 10x13(mm) |
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512Mb Flash+ 512Mb DDR2 |
x8/x16 |
F:2.7~3.6 / D2:1.7~1.9 |
119ball BGA 10x13(mm) |
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512Mb Flash+ 1Gb DDR2 |
x8/x16 |
F:2.7~3.6 / D2:1.7~1.9 |
119ball BGA 10x13(mm) |
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1Gb Flash+ 1Gb DDR2 |
x8/x16 |
F:2.7~3.6 / D2:1.7~1.9 |
119ball BGA 10x13(mm) |
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1Gb Flash + 256Mb MD |
x16 |
F:2.7~3.6 / D2:1.7~1.9 |
107ball BGA 10.5x13(mm) |
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1Gb Flash+ 256Mb MSD |
x16 |
F:2.7~3.6 / D2:1.7~1.9 |
107ball BGA 10.5x13(mm) |
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1Gb Flash+ 512Mb MD |
x16 |
F:2.7~3.6 / D2:1.7~1.9 |
107ball BGA 10.5x13(mm) |
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1Gb Flash+ 512Mb MSD |
x16 |
F:2.7~3.6 / D2:1.7~1.9 |
107ball BGA 10.5x13(mm) |
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512Mb Flash + 256Mb MD |
x16 |
F:2.7~3.6 / D2:1.7~1.9 |
107ball BGA 10.5x13(mm) |
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512Mb Flash+ 256Mb MSD |
x16 |
F:2.7~3.6 / D2:1.7~1.9 |
107ball BGA 10.5x13(mm) |
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512Mb Flash+ 512Mb MD |
x16 |
F:2.7~3.6 / D2:1.7~1.9 |
107ball BGA 10.5x13(mm) |
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512Mb Flash+ 512Mb MSD |
x16 |
F:2.7~3.6 / D2:1.7~1.9 |
107ball BGA 10.5x13(mm) |
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| Tel : +886-3-5730808 Fax : +886-3-5720518 Sales@memocom.com.tw |
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